Power amplifier module
US11196394B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2019 |
| Grant date | Dec 7, 2021 |
| Priority date | — |
| Expiry date | Jun 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2203/21142
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A power amplifier module includes a first substrate and a second substrate, at least part of the second substrate being disposed in a region overlapping the first substrate. The second substrate includes a first amplifier circuit and a second amplifier circuit. The first substrate includes a first transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; a second transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; and multiple first conductors disposed in a row between the first transformer and the second transformer, each of the multiple first conductors extending from the wiring layer on a first main surface to the wiring layer on a second main surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.