Thermal management using variation of thermal resistance of thermal interface
US11201104B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2019 |
| Grant date | Dec 14, 2021 |
| Priority date | — |
| Expiry date | Feb 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/481
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal management system includes an integrated circuit having an active side including a control circuit and a backside including a first set of electrodes distributed across the backside. The thermal management system includes a heat exchanger having a surface including a second set of electrodes. The thermal management system includes a thermal interface material including thermally conductive particles suspended in a fluid. The thermal interface material is disposed between the backside of the integrated circuit and the surface of the heat exchanger. The control circuit is configured to apply an electric field to the thermal interface material using a first electrode of the first set of electrodes and a second electrode of the second set of electrodes to excite at least some of the thermally conductive particles between the first electrode and the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.