Patent · US Active

Device comprising contact to contact coupling of packages

US11201127B2 · kind B2 · utility

1Cited by

2References

39Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Jonghae Kim · San Diego, US
Milind Shah · San Diego, US
Periannan Chidambaram · San Diego, US

Key dates

Filing date	Mar 9, 2020
Grant date	Dec 14, 2021
Priority date	—
Expiry date	Mar 9, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15321
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device that includes a first package and a second package coupled to the first package. The first package includes a first integrated device, a first encapsulation layer encapsulating the first integrated device, a plurality of vias traveling through the first encapsulation layer, a first redistribution portion comprising a first plurality of redistribution interconnects, wherein the first redistribution portion is coupled to the first encapsulation layer, and a first plurality of contacts coupled to the first integrated device. The second package includes a passive device, a second encapsulation layer encapsulating the passive device, a second redistribution portion comprising a second plurality of redistribution interconnects, wherein the second redistribution portion is coupled to the passive device and the second encapsulation layer, and a second plurality of contacts coupled to the passive device, wherein the second plurality of contacts is coupled to the first plurality of contacts from the first package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.