System and method for monitoring treatment of microelectronic substrates with fluid sprays such as cryogenic fluid sprays
US11207715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2019 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Apr 26, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques herein pertain to apparatus embodiments and methods for treating the surface of a microelectronic substrate, and in particular for removing objects from the microelectronic substrate using fluid treatment sprays such as cryogenic fluid sprays. The apparatus embodiments and methods described herein further include techniques for monitoring and/or controlling treatment processes for removing particles from surfaces of a microelectronic substrate. The techniques allow using image analysis techniques to monitor characteristics of spray nozzle(s) (e.g., frost formation on the nozzle surface) and using the resultant image information of the nozzle to take corrective action if frost or another nozzle condition is detected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.