Patent · US Active

Method for manufacturing a MEMS unit for a micromechanical pressure sensor

US11208319B2 · kind B2 · utility

0Cited by

1References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Arne Dannenberg · Metzingen, DE
Joachim Fritz · Rötteln, DE
Thomas Friedrich · Bietigheim-Bissingen, DE
Torsten Kramer · Wannweil, DE

Key dates

Filing date	Feb 13, 2018
Grant date	Dec 28, 2021
Priority date	—
Expiry date	Feb 13, 2038

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/053
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing a MEMS unit for a micromechanical pressure sensor. The method includes the steps: providing a MEMS wafer including a silicon substrate and a first cavity formed therein, under a sensor membrane; applying a layered protective element on the MEMS water; and exposing a sensor core from the back side, a second cavity being formed between the sensor core and the surface of the silicon substrate, and the second cavity being formed with the aid of an etching process which is carried out with the aid of etching parameters changed in a defined manner; and removing the layered protective element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.