Inventor · Wannweil, DE

Torsten Kramer

15Patents
3h-index
36Co-inventors
60Inventor score

Filing activity: Oct 6, 2000 → Jun 24, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US8470631B2 Method for manufacturing capped MEMS components Electricity 9 Active
US9926188B2 Sensor unit including a decoupling structure and manufacturing method therefor Electricity 7 Active
US7989263B2 Method for manufacturing a micromechanical chip and a component having a chip of this type Performing Operations; Transporting 3 Active
US8530261B2 Method for producing a component, and sensor element Performing Operations; Transporting 1 Active
US6655599B2 Data carrier having reset means for interrupting the processing Physics 1 Expired
US6827278B1 Data carrier Physics 1 Expired
US10988377B2 Method for producing a stress-decoupled micromechanical pressure sensor Performing Operations; Transporting 0 Active
US10473683B2 Sensor element for thermal anemometry Performing Operations; Transporting 0 Active
US12145808B2 Method and device for handling (hygiene) products Performing Operations; Transporting 0 Active
US11208319B2 Method for manufacturing a MEMS unit for a micromechanical pressure sensor Performing Operations; Transporting 0 Active
US8389327B2 Method for manufacturing chips Electricity 0 Active
US8405210B2 Method for producing a plurality of chips and a chip produced accordingly Performing Operations; Transporting 0 Active
US8519494B2 Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate Performing Operations; Transporting 0 Active
US10950455B2 Method for manufacturing a semiconductor device and semiconductor device Electricity 0 Active
US9475693B2 ASIC element, in particular as a component of a vertically integrated hybrid component Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.