Methods for cleaning semiconductor device manufacturing apparatus
US11211232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Apr 30, 2039 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA01D5/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.