Image sensor package
US11211414B2 · kind B2 · utility
0Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2019 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Apr 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/809
Abstract
An image sensor package includes a transparent substrate with a recess formed in the transparent substrate, and an image sensor positioned in the recess so that light incident on the transparent substrate passes through the transparent substrate to the image sensor. The image sensor package also includes a circuit board electrically disposed in the recess and coupled to receive image data from the image sensor, and the image sensor is positioned in the recess between the circuit board and the transparent substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.