Ying Chung
6Patents
0h-index
5Co-inventors
30Inventor score
Filing activity: Sep 16, 2016 → Nov 18, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9922922B1 | Microchip with cap layer for redistribution circuitry and method of manufacturing the same | Electricity | 0 | Active |
| US11626434B2 | Image sensor package | Electricity | 0 | Active |
| US11334429B2 | Non-volatile memory apparatus and reading method thereof | Electricity | 0 | Active |
| US11211414B2 | Image sensor package | Electricity | 0 | Active |
| US10783032B2 | Non-volatile memory apparatus and reading method thereof | Electricity | 0 | Active |
| US10199333B2 | Delamination-resistant semiconductor device and associated method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.