Method of fabricating a semiconductor structure with an antenna module
US11211687B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2018 |
| Grant date | Dec 28, 2021 |
| Priority date | — |
| Expiry date | Dec 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/04105
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method making a semiconductor structure with an antenna module. The semiconductor structure includes an antenna substrate with a first surface and a second surface opposite to the first surface; an antenna module is disposed on the first surface of the antenna substrate; and a redistribution layer is disposed on the second surface of the antenna substrate. The method of making the semiconductor structure with the antenna includes fabricating the antenna module and the redistribution layer on two opposite surfaces of the antenna substrate, the material of the antenna substrate for supporting the antenna module can be selected according to actual needs, to provide more options. Signal loss can be reduced through the selection of the antenna substrate; the redistribution layer is provided on the surface of the antenna substrate for bonding the semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.