Patent · US Active

Micromechanical device including a covering bond frame

US11214482B2 · kind B2 · utility

0Cited by

0References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jochen Reinmuth · Reutlingen, DE
Martin Rambach · Neckartenzlingen, DE

Key dates

Filing date	Oct 4, 2018
Grant date	Jan 4, 2022
Priority date	—
Expiry date	Oct 4, 2038

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0109
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A micromechanical device that includes a substrate, a functional layer, and a cap that are situated one above the other in parallel to a main plane of extension. A cavity that is surrounded by a bond frame that extends in parallel to the main plane of extension is formed in the functional layer, the cap being connected to the bond frame. The cavity is situated partially between the bond frame and the substrate in a direction perpendicular to the main plane of extension. A method for manufacturing a micromechanical device is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.