Patent · US Active

Inductive assembly and method of manufacturing inductive assembly

US11217378B2 · kind B2 · utility

0Cited by
3References
12Claims
0Family size

Assignee

Inventor

Key dates

Filing dateNov 30, 2017
Grant dateJan 4, 2022
Priority date
Expiry dateOct 16, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01F2027/065
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An inductive assembly includes: a support with an open channel having a straight portion with a bottom surface and two side surfaces, a foldable PCB such that to cover at least a part of the bottom surface and the side surfaces, the PCB having a plurality of tracks, each track being electrically continuous between a pair of connecting spots, a magnetic piece which can be accommodated into the channel equipped with the PCB. The PCB is arranged to surround at least partially a portion of the magnetic piece in the folded state in the channel such that at least one connecting spot of a first track is electrically connected to a connecting spot of a second track to form a winding around the magnetic piece and to inductively couple the PCB and the magnetic piece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.