Patent · US Active

RF capacitive coupled dual frequency etch reactor

US11217434B2 · kind B2 · utility

2Cited by
3References
33Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 17, 2017
Grant dateJan 4, 2022
Priority date
Expiry dateOct 20, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/3341
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

In a capacitively coupled etch reactor, in which the smaller electrode is etched, the larger electrode is electrically supplied by a very high frequency supply signal and by a high frequency supply signal. The smaller electrode, acting as a substrate carrier, is connected to ground potential.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.