Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof
US11217554B2 · kind B2 · utility
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15References
27Claims
0Family size
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Key dates
| Filing date | Jun 7, 2018 |
| Grant date | Jan 4, 2022 |
| Priority date | — |
| Expiry date | Jun 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.