Ormet Circuits, Inc.
12Patents
11Active
12Granted
46Portfolio score
Filing activity: May 15, 2002 → Sep 9, 2020 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9583453B2 | Semiconductor packaging containing sintering die-attach material | Electricity | 8 | Active |
| US6716036B2 | Method of attaching circuitry to a modular jack connector using electrically conductive paste | Electricity | 8 | Expired |
| US9545017B2 | Structures for z-axis interconnection of multilayer electronic substrates | Electricity | 8 | Active |
| US8221518B2 | Conductive compositions containing blended alloy fillers | Electricity | 8 | Active |
| US9005330B2 | Electrically conductive compositions comprising non-eutectic solder alloys | Performing Operations; Transporting | 5 | Active |
| US8840700B2 | Preparation of metallurgic network compositions and methods of use thereof | Electricity | 3 | Active |
| US9003648B2 | Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias | Emerging Cross-Sectional Technologies | 3 | Active |
| US11217554B2 | Metallic adhesive compositions having good work lives and thermal conductivity, methods of making same and uses thereof | Electricity | 0 | Active |
| US11440142B2 | Alternative compositions for high temperature soldering applications | Electricity | 0 | Active |
| US12388004B2 | Lithographically defined electrical interconnects from conductive pastes | Electricity | 0 | Active |
| US10727193B2 | Sintering pastes with high metal loading for semiconductor die attach applications | Electricity | 0 | Active |
| US12053934B2 | Conductive film adhesive | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.