Patent · US Active

Method and device for establishing a wire connection as well as a component arrangement having a wire connection

US11217558B2 · kind B2 · utility

0Cited by

7References

11Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Andrej Kolbasow · Paulinenaue, DE
Jan Hoffmann · Rosbach, DE
Matthias Fettke · Berlin, DE

Key dates

Filing date	Mar 15, 2018
Grant date	Jan 4, 2022
Priority date	—
Expiry date	Mar 17, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01R43/0263
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.