Pac Tech—Packaging Technologies Gmbh
61Patents
37Active
61Granted
47Portfolio score
Filing activity: Apr 22, 1996 → May 29, 2024 · 14 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6281577A | Chips arranged in plurality of planes and electrically connected to one another | Electricity | 240 | Expired |
| US6394158B1 | Method and device for thermally bonding connecting surfaces of two substrates | Electricity | 26 | Expired |
| US6713714B1 | Method and device for thermally connecting the contact surfaces of two substrates | Electricity | 23 | Expired |
| US5989993A | Method for galvanic forming of bonding pads | Electricity | 16 | Expired |
| US6119919A | Method and device for repairing defective soldered joints | Electricity | 13 | Expired |
| US6769599B1 | Method and device for placing and remelting shaped pieces consisting of solder material | Electricity | 9 | Expired |
| US6059176A | Device and a method for applying a plurality of solder globules to a substrate | Electricity | 9 | Expired |
| US7087442B2 | Process for the formation of a spatial chip arrangement and spatial chip arrangement | Electricity | 7 | Expired |
| US7882997B2 | Method and device for mutual contacting of two wafers | Electricity | 7 | Active |
| US7121449B2 | Method and device for applying material to a workpiece | Electricity | 7 | Expired |
| US9401298B2 | Method and device for transferring a chip to a contact substrate | Electricity | 6 | Active |
| US7829817B2 | Device for removing solder material from a soldered joint | Performing Operations; Transporting | 6 | Expired |
| US6335626B1 | Method and device for determining a parameter for a metallization bath | Electricity | 5 | Expired |
| US7021517B2 | Method and device for applying pieces of material to a workpiece | Electricity | 5 | Expired |
| US6955943B2 | Method for producing a substrate arrangement | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6056188A | Method of attaching a component to a plate-shaped support | Electricity | 4 | Expired |
| US8328068B2 | Transfer device for receiving and transferring a solder ball arrangement | Electricity | 4 | Active |
| US6955284B2 | Device for positioning a tool in relation to a workpiece | Physics | 4 | Expired |
| US7717316B2 | Method and device for applying a solder to a substrate | Electricity | 4 | Active |
| US6915940B2 | Device for applying solder globules | Electricity | 3 | Expired |
| US7007834B2 | Contact bump construction for the production of a connector construction for substrate connecting surfaces | Electricity | 3 | Expired |
| US6328200A | Process for selective soldering | Electricity | 2 | Expired |
| US8330076B2 | Method and device for removing solder material deposits from a substrate | Performing Operations; Transporting | 2 | Active |
| US10354971B2 | Method for producing a chip module | Electricity | 2 | Active |
| US8361881B2 | Method for alternately contacting two wafers | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.