Circuit board and manufacturing method thereof
US11219130B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2019 |
| Grant date | Jan 4, 2022 |
| Priority date | — |
| Expiry date | Sep 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board including a substrate, a patterned conductive layer, a patterned insulating layer, a conductive terminal, and a dummy terminal is provided. The patterned conductive layer is disposed on the substrate. The patterned insulating layer is disposed on the substrate and at least covers a portion of the patterned conductive layer. The conductive terminal is disposed on the patterned conductive layer and has a first top surface. The dummy terminal is disposed on the patterned conductive layer and has a second top surface. A first height between the first top surface and the substrate is greater than a second height between the second top surface and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.