Method of manufacture including polishing pad monitoring method and polishing apparatus including polishing pad monitoring device
US11222786B2 · kind B2 · utility
1Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2019 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Feb 10, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.