Low-inductance current paths for on-package power distributions and methods of assembling same
US11222837B2 · kind B2 · utility
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1References
16Claims
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Key dates
| Filing date | Apr 2, 2020 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Apr 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro-trace containing package substrate provides a low-inductance alternating-current decoupling path between a semiconductive device and a die-side capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.