Method for fabricating electronic package
US11222852B2 · kind B2 · utility
2Cited by
22References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2019 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Sep 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q23/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.