Electronic package and electronic device having the electronic package
US11223117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2018 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Sep 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package includes: a carrier structure; a first electronic component disposed on the carrier structure; a first insulating layer formed on the carrier structure; a first antenna structure coupled to the first insulating layer and electrically connected to the first electronic component; and a second antenna structure embedded in the carrier structure. As such, the electronic package provides more antenna functions within a limited space so as to improve the signal quality and transmission rate of electronic products. An electronic device having the electronic package is also provided. The electronic device is applicable to an electronic product having an antenna function.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.