Edge interconnects for use with circuit boards and integrated circuits
US11224126B2 · kind B2 · utility
0Cited by
1References
15Claims
0Family size
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Key dates
| Filing date | Jan 9, 2020 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Jan 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate assembly includes at least one printed circuit (PC) substrate. Each PC substrate includes a PC top surface and a PC bottom surface spaced from each other and an edge that runs at least partially about a periphery of the PC substrate between the PC top surface and the PC bottom surface. The edge includes or defines on a facet or edge surface of the edge at least one projection that extends transverse or normal to the facet or edge surface. The projection includes a projection top surface and a projection bottom surface spaced from each other and the projection can include or be made of conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.