Semiconductor device package and method of manufacturing the same
US11224132B2 · kind B2 · utility
1Cited by
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19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2019 |
| Grant date | Jan 11, 2022 |
| Priority date | — |
| Expiry date | Nov 22, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.