Patent · US Active

Mold and device for marking work pieces

US11225001B2 · kind B2 · utility

0Cited by
1References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 25, 2018
Grant dateJan 18, 2022
Priority date
Expiry dateJun 10, 2039

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C2045/14286
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A device for marking a work piece that is at least partially formed or reshaped through a thermal process is provided. The device includes a plurality of heating elements distributed laterally on a surface that is placed against the work piece and can be individually controlled for local heating of a work piece surface. Each of the heating elements includes a solid material with a surface structure and a heating structure. The surface structure includes at least one of a specifically or randomly varied topography. The surface structure can be at least partially heated through the heating structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.