Mold and device for marking work pieces
US11225001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2018 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jun 10, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/14286
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A device for marking a work piece that is at least partially formed or reshaped through a thermal process is provided. The device includes a plurality of heating elements distributed laterally on a surface that is placed against the work piece and can be individually controlled for local heating of a work piece surface. Each of the heating elements includes a solid material with a surface structure and a heating structure. The surface structure includes at least one of a specifically or randomly varied topography. The surface structure can be at least partially heated through the heating structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.