Patent · US Active

Integrated cable probe design for high bandwidth RF testing

US11226353B2 · kind B2 · utility

0Cited by

3References

21Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Chengqing Hu · Chandler, US
Mayue Xie · Phoenix, US
Simranjit S. Khalsa · Chandler, US
Deepak Goyal · Phoenix, US

Key dates

Filing date	Mar 31, 2017
Grant date	Jan 18, 2022
Priority date	—
Expiry date	Jul 2, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01R2201/20
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.