Deepak Goyal
34Patents
7h-index
70Co-inventors
72Inventor score
Filing activity: Jun 21, 1974 → Aug 4, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7171407B2 | Method for streaming XPath processing with forward and backward axes | Emerging Cross-Sectional Technologies | 50 | Expired |
| US7222317B1 | Circuit comparison by information loss matching | Physics | 44 | Expired |
| US3942163A | CCD stack memory organization | Physics | 18 | Expired |
| US10935593B2 | Method of resonance analysis for electrical fault isolation | Physics | 16 | Active |
| US3997882A | Content addressable memory system employing charge coupled device storage and directory registers and N/(1-H) counter refresh synchronization | Physics | 16 | Expired |
| US7350168B1 | System, method and computer program product for equivalence checking between designs with sequential differences | Physics | 14 | Expired |
| US10754518B1 | Techniques for providing customized user interface components in a push notification | Electricity | 12 | Active |
| US7287235B1 | Method of simplifying a circuit for equivalence checking | Physics | 7 | Expired |
| US8122401B1 | System, method, and computer program product for determining equivalence of netlists utilizing at least one transformation | Physics | 6 | Active |
| US9389064B2 | Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens | Physics | 4 | Active |
| US8117571B1 | System, method, and computer program product for determining equivalence of netlists utilizing abstractions and transformations | Physics | 3 | Active |
| US10361167B2 | Electronic assembly using bismuth-rich solder | Electricity | 3 | Active |
| US7280190B1 | Electro-optic time domain reflectometry | Physics | 2 | Active |
| US9508610B2 | Inline measurement of molding material thickness using terahertz reflectance | Electricity | 1 | Active |
| US9625256B1 | Device, system and method for alignment of an integrated circuit assembly | Electricity | 1 | Active |
| US11346818B2 | Method, device and system for non-destructive detection of defects in a semiconductor die | Physics | 1 | Active |
| US9291576B2 | Detection of defect in die | Physics | 1 | Active |
| US9817028B2 | Terahertz transmission contactless probing and scanning for signal analysis and fault isolation | Physics | 1 | Active |
| US9746428B2 | Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens | Physics | 1 | Active |
| US12271742B2 | Automatically executing application routines with user inputs | Physics | 0 | Active |
| US10746780B2 | High power terahertz impulse for fault isolation | Physics | 0 | Active |
| US11791237B2 | Microelectronic assemblies including a thermal interface material | Electricity | 0 | Active |
| US11798861B2 | Integrated heat spreader (IHS) with heating element | Electricity | 0 | Active |
| US11476120B2 | Method of sample preparation using dual ion beam trenching | Electricity | 0 | Active |
| US11551956B2 | Method and device for failure analysis using RF-based thermometry | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.