Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component
US11226560B2 · kind B2 · utility
1Cited by
10References
13Claims
0Family size
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Key dates
| Filing date | Feb 22, 2018 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jul 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13144
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.