Antenna package structure and antenna packaging method
US11228087B2 · kind B2 · utility
0Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2019 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jul 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16237
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an antenna package structure and an antenna packaging method. The package structure includes an antenna circuit chip, a first packaging layer, a first rewiring layer, an antenna structure, a second metal connecting column, a third packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using the rewiring layer and the metal connecting column.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.