Antenna packaging module and making method thereof
US11228089B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 22, 2020 |
| Grant date | Jan 18, 2022 |
| Priority date | — |
| Expiry date | Jul 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The application describes an antenna packaging module for a semiconductor chip and a method for making it. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a metal bump, a third packaging layer and a packaging antenna connector. The antenna structure comprises a connector opening, a first antenna structure and a second antenna structure stacked on the second surface of the redistribution layer. The packaging antenna connector is disposed in the connector opening, and is electrically connected to the redistribution layer. Electrical interconnection of packaging an antenna connector in a connector opening in the packaging layer, the antenna signal loss is reduced, and the overall e advantage of WLP AiP is further improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.