Film structure reproduction method and reproduction film structure
US11230762B2 · kind B2 · utility
0Cited by
1References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 27, 2019 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Sep 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3065
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of easily reproducing a film structure with low cost and a reproduction film structure manufactured using the same, the film structure reproduction method includes: a new film layer deposition step of depositing a new SiC layer on a non-active surface opposite to a damaged active surface; and an active surface fabrication step of fabricating the active surface to obtain a focus ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.