ADMAP INC.
10Patents
9Active
10Granted
46Portfolio score
Filing activity: Mar 4, 2002 → Oct 25, 2019 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8507922B2 | Silicon carbide substrate, semiconductor device, and SOI wafer | Electricity | 3 | Active |
| US7087980B2 | Film thickness measuring monitor wafer | Electricity | 2 | Expired |
| US11049747B2 | SiC freestanding film structure | Chemistry; Metallurgy | 0 | Active |
| US11508570B2 | SiC film structure | Electricity | 0 | Active |
| US11380445B2 | Tubular body containing SiC fiber and method for producing the same | Chemistry; Metallurgy | 0 | Active |
| US10804096B2 | SiC film structure and method for manufacturing SiC film structure | Electricity | 0 | Active |
| US11453620B2 | SiC coat | Electricity | 0 | Active |
| US11597655B2 | SiC member | Electricity | 0 | Active |
| US8291581B2 | Method for production of substrate electrode for plasma processing | Emerging Cross-Sectional Technologies | 0 | Active |
| US11230762B2 | Film structure reproduction method and reproduction film structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.