Headphone structure
US11234067B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2020 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Aug 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headphone structure includes a front housing, a rear housing combined to the front housing, a mesh cover, a sound-producing unit disposed within the front housing, and an elastic earbud. The front housing includes a protruding post portion, a sound channel formed on a front end surface of the protruding post portion, a slit formed on the protruding post portion, and a bearing flange formed on an inner surface of the sound channel to load the mesh cover. One distal end of the slit is connected to the inner surface of the sound channel, and one part of the protruding post portion is arranged between the front end surface of the protruding post portion and the distal end of the slit. The elastic earbud is elastically sleeved on the protruding post portion, so an elongated air vent is formed by the elastic earbud and the slit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.