Circuit board structure and manufacturing method thereof
US11234324B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2021 |
| Grant date | Jan 25, 2022 |
| Priority date | — |
| Expiry date | Feb 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1536
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board structure includes a first dielectric layer, at least one first circuit layer, a second dielectric layer, and an insulating protection layer. The first circuit layer is mounted on the first dielectric layer, and includes at least one first circuit. The second dielectric layer is mounted on the first circuit layer, and includes at least one thermally conductive bump and at least one electrically conductive bump. The electrically conductive bump is electrically connected to the first circuit. The insulating protection layer is mounted on the second dielectric layer. The thermally conductive bump directly contacts the glass substrate. When lasering is applied to cut the glass substrate for de-bonding, the lasering heat energy can be absorbed and dissipated by the thermally conductive bump, resolving the problem of circuit de-bonding and raising the process yield. In addition, a manufacturing method of the circuit board structure is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.