Protective layers for processing chamber components

US11239058B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Karthikeyan Balaraman · Kanchinakote, IN
• Balamurugan Ramasamy · Kanchinakote, IN
• Kartik Shah · Saratoga, US
• Mats Larsson · Kalmar, SE
• Kevin A. PAPKE · Portland, US
• Rajasekhar PATIBANDLA · Kanchinakote, IN
• Sathyanarayana Bindiganavale · Bengaluru, IN
• Umesh M. Kelkar · Santa Clara, US

Key dates

• Filing date: May 14, 2019
• Grant date: Feb 1, 2022
• Expiry date: May 25, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/334
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure provide protective coatings, i.e., diffusion and thermal barrier coatings, for aluminum alloy substrates. In particular, embodiments described herein provide a protective layer stack comprising a tantalum nitride layer disposed on an aluminum alloy substrate and a ceramic layer disposed on the tantalum nitride layer. In some embodiments, the aluminum alloy substrates comprise processing chambers and processing chamber components used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, an article includes a substrate, a tantalum nitride layer disposed on the substrate, and a ceramic layer disposed on the tantalum nitride layer.