Wafer supply device
US11239101B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2017 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Feb 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67271
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device includes a die information storage section configured to store the number of dies for each rank allocated to each of the dies, a block information acquisition section configured to acquire a condition of dies to be mounted on a block provided on a board to be conveyed, a required block number acquisition section configured to acquire a required number of dies to be mounted on the block, and a producible number calculation section configured to calculate a number of blocks that can be produced based on a content stored in the die information storage section and a content acquired by the block information acquisition section and the required block number acquisition section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.