Patent · US Active

Rod-based substrate with ringed interconnect layers

US11239126B2 · kind B2 · utility

0Cited by

3References

26Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Florence Su Sin Phun · Air Itam, MY
Wei Tan · Chandler, US
Boon Ping Koh · Permatang Janggus, MY
Nik Mohamed Azeim Nik Zurin · Bayan Lepas, MY
Kai Chong Ng · Butterworth, MY

Key dates

Filing date	Mar 31, 2017
Grant date	Feb 1, 2022
Priority date	—
Expiry date	Nov 20, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10166
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.