Wei Tan
4Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Dec 23, 2011 → Mar 31, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9960105B2 | Controlled solder height packages and assembly processes | Electricity | 6 | Active |
| US9283641B2 | Flux materials for heated solder placement and associated techniques and configurations | Electricity | 0 | Active |
| US11239126B2 | Rod-based substrate with ringed interconnect layers | Electricity | 0 | Active |
| US9950393B2 | Hybrid low metal loading flux | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.