Wire bond inductor structures for flip chip dies

US11239158B1 · kind B1 · utility

Assignee

• QUALCOMM Incorporated · US

Inventors

• Paragkumar Ajaybhai Thadesar · San Diego, US
• Changhan Hobie Yun · San Diego, US
• Sameer S. Vadhavkar · Boise, US
• Daniel Daeik Kim · San Diego, US
• Francesco Carrara · Trecastagni, IT

Key dates

• Filing date: Oct 8, 2020
• Grant date: Feb 1, 2022
• Expiry date: Oct 8, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit (IC) package comprising a first die, including an active layer opposite a backside surface of the first die supporting a plurality of backside pads is provided. The IC package also incorporates a package substrate coupled to the active layer. The package pads on the package substrate correspond to the plurality of backside pads. A passive device comprising a plurality of wire bonds is coupled to the plurality of backside pads and the plurality of package pads. The passive device may also comprise a plurality of wire bonds coupled to the package pads by through silicon vias (TSVs). Multiple dies may be coupled with die-to-die wire bonds coupled to backside pads on each die.