Daniel Daeik Kim
15Patents
1h-index
23Co-inventors
46Inventor score
Filing activity: Aug 10, 2016 → Dec 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11515247B2 | Capacitance fine tuning by fin capacitor design | Electricity | 1 | Active |
| US11011461B2 | Perpendicular inductors integrated in a substrate | Electricity | 1 | Active |
| US12009292B2 | Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variation | Electricity | 0 | Active |
| US12402332B2 | Integrated passive devices | Electricity | 0 | Active |
| US10319694B2 | Semiconductor assembly and method of making same | Electricity | 0 | Active |
| US11658403B2 | Device, package and/or substrate comprising curved antenna | Electricity | 0 | Active |
| US10903240B2 | Integrated circuits (ICs) on a glass substrate | Electricity | 0 | Active |
| US11380471B2 | RF damping structure in inductive device | Electricity | 0 | Active |
| US11502652B2 | Substrate comprising capacitor configured for power amplifier output match | Electricity | 0 | Active |
| US10879191B2 | Conformal shielding for solder ball array | Electricity | 0 | Active |
| US12016247B2 | Package comprising an integrated passive device configured as a cap for a filter | Electricity | 0 | Active |
| US11770115B2 | Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methods | Electricity | 0 | Active |
| US11239158B1 | Wire bond inductor structures for flip chip dies | Electricity | 0 | Active |
| US11728293B2 | Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component | Electricity | 0 | Active |
| US11817239B2 | Embedded vertical inductor in laminate stacked substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.