Patent · US Active

Stacked modules

US11239170B2 · kind B2 · utility

1Cited by

21References

10Claims

0Family size

Assignee

SnapTrack, Inc. · US

Inventors

Andreas Franz · Ludwigsburg, DE
Jürgen Portmann · Munich, DE
Claus Reitlinger · Wolnzach, DE
Stefan Kiefl · Munich, DE
Oliver Freudenberg · Birkenfeld, DE
Karl Weidner · Birkenfeld, DE

Key dates

Filing date	Dec 2, 2016
Grant date	Feb 1, 2022
Priority date	—
Expiry date	Dec 2, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10B99/22
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention relates to a module that has a lower component of a module (1) having a material (3) in which at least one first structural element (4) is embedded, and an upper component of a module (2) having a material (3) in which at least a second component (16) is embedded. The upper component of the module (2) and the lower component of the module (1) are stacked, with the lower and the upper component of the module (2) being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.