Optoelectronic semiconductor component
US11239386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | Apr 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.