Sub-module L-shaped millimeter wave antenna-in-package
US11239573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2020 |
| Grant date | Feb 1, 2022 |
| Priority date | — |
| Expiry date | May 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q25/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna-in-package (AiP) module is described. The AiP module includes an antenna sub-module. The antenna sub-module is composed of a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface. The first package substrate is composed of a non-linear portion between the first group of antennas and the second group of antennas. The AiP module includes an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.