Sensor chip and associated calibration lead frame
US11243270B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2020 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Aug 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A packaged sensor chip includes a lead frame to which there is attached a sensor element designed to generate a sensor signal that depends on a magnetic field to which the sensor element is exposed; and a package therefor, wherein the lead frame has function terminals and wherein the lead frame has at least two calibration terminals that are arranged on two other opposing sides of the package, wherein the lead frame has conductive structures that connect the at least two calibration terminals, wherein the conductive structures are structured so as to generate a calibration magnetic field for the sensor element when a current flows through them, and wherein the conductive structures are part of a connection structure that connects a plurality of lead frames before the plurality of lead frames are disconnected from one another in a first direction in which the other two sides are opposite one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.