Die ejectors and die supplying apparatuses including ihe same
US11244840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2019 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Aug 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die ejector includes a supporter configured to support a film on which a die is attached in a vertical direction, an elevation device in a hole of the supporter and configured to move the film with the die attached thereon in the vertical direction and in relation to the supporter, a driver configured to move the elevation device in the vertical direction, an air conduit guide in an enclosure region at least partially defined by an inner surface of the elevation device and having an inner surface defining an air flow conduit, a pressure adjuster device configured to induce air flow through the air flow conduit based on inducing a pressure gradient between the air flow conduit and the pressure adjuster device, and a flow guide in the air flow conduit and configured to control a flow of air through at least a portion of the air flow conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.