Jung Lae Jung
6Patents
1h-index
6Co-inventors
33Inventor score
Filing activity: Feb 20, 2018 → Mar 27, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10410990B2 | Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus | Electricity | 6 | Active |
| US10748855B2 | Laminating device and method for fabricating semiconductor package using the same | Electricity | 1 | Active |
| US11244840B2 | Die ejectors and die supplying apparatuses including ihe same | Electricity | 0 | Active |
| US10833046B2 | Stack tool for reflow and stack apparatus having the same | Electricity | 0 | Active |
| US10900883B2 | Mold test apparatus and method | Electricity | 0 | Active |
| US10741430B2 | Stack boat tool and method using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.