Vacuum chamber arrangement and method for processing a substrate

US11244845B2 · kind B2 · utility

Assignee

• VON ARDENNE Asset GmbH & Co KG · DE

Inventors

• Joerg Pollack · Freital, DE
• Lutz Gottsmann
• Georg Laimer · Meißen, DE

Key dates

• Filing date: Sep 26, 2018
• Grant date: Feb 8, 2022
• Expiry date: Mar 17, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68764
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A vacuum chamber having a vacuum chamber; at least one processing region arranged in the vacuum chamber; and a substrate holding arrangement for transporting and/or positioning a substrate or multiple substrates in the processing region, wherein the substrate holding arrangement has: a first drive train with a first substrate holder, the first substrate holder being configured to rotatably hold one or more substrates, a second drive train with a first support arm, wherein the first substrate holder is held rotatably by the first support arm, a third drive train with a second substrate holder, the second substrate holder being configured for rotatably holding one or more substrates, and a fourth drive train with a second support arm, wherein the second substrate holder is held rotatably by the second support arm, and wherein the first, second, third and fourth drive trains are each configured to be controllable independently of one another.