Package terminal cavities
US11244881B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2019 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Sep 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/561
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package comprises a molding and a conductive terminal in contact with the molding and having a first surface exposed to a first surface of the molding. The conductive terminal includes a cavity having a first portion extending along at least half of the first surface of the conductive terminal and a second portion extending along less than half of the first surface of the conductive terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.