Semiconductor package having a coaxial first layer interconnect

US11244912B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Sai Vadlamani · Chandler, US
• Aleksandar Aleksov · Chandler, US
• Rahul Jain · Chandler, US
• Kyu Oh Lee · Chandler, US
• Kristof Darmawikarta · Chandler, US
• Robert Alan May · Chandler, US
• Sri Ranga Sai Boyapati · Chandler, US
• Telesphor Kamgaing · Chandler, US

Key dates

• Filing date: Mar 30, 2017
• Grant date: Feb 8, 2022
• Expiry date: Mar 30, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/81359
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Semiconductor packages having a first layer interconnect portion that includes a coaxial interconnect between a die and a package substrate are described. In an example, the package substrate includes a substrate-side coaxial interconnect electrically connected to a signal line. The die is mounted on the package substrate and includes a die-side coaxial interconnect coupled to the substrate-side coaxial interconnect. The coaxial interconnects can be joined by a solder bond between respective central conductors and shield conductors.