System and method for allowing restoration of interconnection of die of power module
US11251151B2 · kind B2 · utility
1Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2018 |
| Grant date | Feb 15, 2022 |
| Priority date | — |
| Expiry date | Oct 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention concerns a system for allowing the restoration of an interconnection of a die of a power module, a first terminal of the interconnection being fixed on the die and a second terminal of the interconnection being connected to an electric circuit. The system comprises:—at least one material located in the vicinity of the first terminal of the interconnection, the material having a predetermined melting temperature,—means for controlling the temperature of the die at the predetermined melting temperature during a predetermined period of time. The present invention concerns also the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.